SEMICONDUCTOR PACKAGE
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United States of America Patent
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Issued Date -
Sep 17, 2015
app pub date -
Mar 4, 2015
filing date -
Mar 11, 2014
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A semiconductor package includes a wiring substrate including a first surface and a second surface that are opposed to each other, a plurality of mounting pads arranged on the first surface, and a plurality of connection pads arranged on the second surface, and a plurality of connection members respectively connected to the connection pads. Each of the connection members includes a holding member opposing the second surface of the wiring substrate, and a plurality of elastic and conductive connection terminals. Each of the connection terminals includes a first end and a second end. The first end is held by the holding member so that the first end is exposed from a surface of the holding member that is located at a side opposite to the wiring substrate. The second end is connected to a corresponding one of the connection pads.
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