Semiconductor device and manufacturing method thereof
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United States of America Patent
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Feb 16, 2016
Grant Date -
Sep 17, 2015
app pub date -
Sep 12, 2014
filing date -
Mar 12, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
According to one embodiment, a semiconductor device includes a first loop and a second loop. A folded-back portion is a portion formed by stretching out the first loop from a first bond in a first direction and then folding it back in a second direction. The folded-back portion is in a shape in which it is squashed against the first bond. The second loop is bonded to the folded-back portion. An end of the second loop is located at a second position. The second position is offset in a direction in which the first loop extends, from a first position. The first position is the center of the first bond of the first loop.
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