SEMICONDUCTOR MEMORY DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR MEMORY DEVICE
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United States of America Patent
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Issued Date -
Sep 17, 2015
app pub date -
Dec 17, 2014
filing date -
Mar 13, 2014
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Abandoned
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Abstract
According to an embodiment, a semiconductor memory device includes a semiconductor chip that includes first memory regions and second memory regions provided with a memory cell for storing data, and a packaging substrate in which a bonding wire is bonded to the semiconductor chip by bonding wire, in which a concentration of a chemical element of a mobile ion in the first memory region is higher than a concentration of a chemical element of a mobile ion in the second memory region.
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