Integrated circuit assemblies with reinforcement frames, and methods of manufacture

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United States of America Patent

PATENT NO 9355997
SERIAL NO

14288064

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An assembly with modules (110, 1310) containing integrated circuits and attached to a wiring substrate (120) is reinforced by one or more reinforcement frames (410) attached to the wiring substrate. The modules are located in openings (e.g. cavities and/or through-holes 414) in the reinforcement frame. Other features are also provided.

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Patent Owner(s)

  • INVENSAS CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Katkar, Rajesh San Jose, US 222 4587
Mirkarimi, Laura Wills Sunol, US 77 2487
Sitaram, Arkalgud Cupertino, US 17 356
Woychik, Charles G San Jose, US 106 2139

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