Importance

Loading Importance Indicators...

Abstract

A semiconductor device manufacturing method includes mounting a stacked body on a first surface of a wiring substrate, the stacked body including a metal plate and semiconductor chips that are stacked on a part of the metal plate and located on the first surface side of the wiring substrate, forming a resin layer to seal the stacked body on the first surface of the wiring substrate, forming a first cut reaching the sealing resin layer by using a first dicing blade while cutting either the metal plate or the wiring substrate, the first cut surrounding the stacked body, and forming a second cut reaching the first cut using a second dicing blade while cutting the other of the metal plate and the wiring substrate to separate the wiring substrate in correspondence with the location of the stacked body, the second cut also surrounding the stacked body.

Loading the Abstract Image...

First Claim