Semiconductor Device and Manufacturing Method Thereof

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United States of America Patent

APP PUB NO 20150263033A1
SERIAL NO

14482285

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Abstract

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In a manufacturing method of a semiconductor device according to an embodiment, a stacked structure constituted by an electrode, an insulation film, and an amorphous thin film is formed. A microwave of a first frequency is irradiated to the stacked structure so as to selectively heat the electrode. Thereby a seed crystal is formed in a part of the amorphous thin film adjacent to the electrode. A microwave of a second frequency that is different from the first frequency is irradiated to the stacked structure so as to grow the seed crystal. Thereby a polycrystalline thin film is formed.

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Patent Owner(s)

Patent OwnerAddress
KABUSHIKI KAISHA TOSHIBAMINATO-KU TOKYO 105-8001

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
AOYAMA, Tomonori Yokkaichi, JP 78 1371

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