SOLID-STATE IMAGING DEVICE
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United States of America Patent
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Issued Date -
Sep 17, 2015
app pub date -
Mar 2, 2015
filing date -
Mar 14, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Solid-state imaging device includes a photodiode in a semiconductor substrate. A color filter aligned with the photodiode on the substrate. A first reflection layer is formed on the color filter to include a concave curved surface. A transparent supporting layer is formed on the curved surface and second reflection layer is formed on the supporting layer at a position corresponding to a focal point of the concave curved surface. A planarization layer is formed on the second reflection layer and the first reflection layer. A microlens is formed on the planarization layer. The supporting layer and the planarization layer can be formed of a same resin material. The first and second reflection layers are made of materials that have a refractive index higher than a refractive index of the resin material.
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