SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
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United States of America Patent
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Issued Date -
Sep 17, 2015
app pub date -
Sep 10, 2014
filing date -
Mar 12, 2014
priority date (Note) -
Abandoned
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Abstract
In one embodiment, a semiconductor device includes a semiconductor chip including a nitride semiconductor layer, and including a control electrode, a first electrode and a second electrode provided on the nitride semiconductor layer. The device further includes a support including a substrate, and including a control terminal, a first terminal and a second terminal provided on the substrate. The semiconductor chip is provided on the support such that the control electrode, the first electrode and the second electrode face the support. The control electrode, the first electrode and the second electrode of the semiconductor chip are electrically connected to the control terminal, the first terminal and the second terminal of the support, respectively.
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