Importance

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Abstract

In one embodiment, a semiconductor device includes first, second, third, fourth, fifth and sixth electrodes extending in a first direction, the third and fourth electrodes being provided to sandwich the first electrode, the fifth and sixth electrodes being provided to sandwich the second electrode, the first, second, fifth and sixth electrodes being electrically connected with one another, and the third and fourth electrodes being electrically connected with each other and electrically independent from the first, second, fifth and sixth electrodes. The device further includes a semiconductor layer provided between one of the third and fourth electrodes and one of the fifth and sixth electrodes. The device further includes a first interconnect provided on the second, fifth and sixth electrodes and on the semiconductor layer.

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First Claim