WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE USING THE SAME
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United States of America Patent
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N/A
Issued Date -
Sep 17, 2015
app pub date -
Sep 2, 2014
filing date -
Mar 11, 2014
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
According to one embodiment, a wiring substrate includes a second wiring layer, including a plurality of metal lands provided on a second surface of an insulating base material, and an insulating layer formed on the second surface of the insulating base material and including openings exposing the plurality of metal lands. The metal land includes a center portion with a first height and an outer peripheral portion with a second height lower than the first height, which is provided at least about the periphery of the insulating base. The openings expose the metal lands, such that the center portion of the metal land is exposed and at least a portion of the outer peripheral portion of the metal land is covered with the insulating layer.
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