CIRCUIT MOUNTING APPARATUS AND METHOD USING A SEGMENTED LEAD-FRAME
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United States of America Patent
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Issued Date -
Sep 24, 2015
app pub date -
Mar 18, 2014
filing date -
Mar 18, 2014
priority date (Note) -
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Abstract
A circuit mounting assembly having a segmented lead frame, and an integrated circuit mounted on the segmented lead frame. The segmented lead frame has a main body portion with at least one severable slot and a plurality of connectors extending from the main body portion. Electrical communication between the plurality of connectors and the integrated circuit is controlled by severance of the at least one slot.
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