Methods of connecting a first electronic package to a second electronic package
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United States of America Patent
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Feb 16, 2016
Grant Date -
Sep 24, 2015
app pub date -
Mar 19, 2014
filing date -
Mar 19, 2014
priority date (Note) -
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Abstract
A method of fabricating an electronic package. The method includes filling a mold with an electric conductor to form a number of electrical interconnects within the mold. The mold includes openings that are filled with several electric conductors to form a number of electrical interconnects. The method of fabricating an electronic package further includes attaching the mold to a substrate such that the electrical interconnects engage electrical contacts on the substrate. The method of fabricating an electronic package may further include forming conductive pads on the electrical insulator that engage the electrical interconnects and attaching a die to the substrate such that the die is electrically connected to at least some of the electrical interconnects.
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