PAD STRUCTURE FOR SEMICONDUCTOR DEVICE CONNECTION
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United States of America Patent
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Issued Date -
Sep 24, 2015
app pub date -
Mar 13, 2015
filing date -
Mar 25, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A pad structure may include a conductive pad that includes an exposed portion. The pad structure may further include a first conductive set that includes a first conductive part and a second conductive part. The first conductive part may overlap the exposed portion in a direction perpendicular to the conductive pad. The first conductive part may be spaced from the second conductive part in a direction parallel to the conductive pad and may overlap the second conductive part in the direction parallel to the conductive pad. The pad structure may further include a conductive layer that contacts the conductive pad and is positioned between the conductive pad and the first conductive set in the direction perpendicular to the conductive pad. The pad structure may further include a first via member, which may electrically connect the first conductive part to the conductive layer.
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