PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Sep 24, 2015
app pub date -
Mar 20, 2015
filing date -
Mar 20, 2014
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A printed wiring board includes a multilayer core substrate, an electronic component accommodated in an opening portion formed in the multilayer core substrate, and a build-up layer including an interlayer resin insulating layer formed on the multilayer core substrate such that the interlayer resin insulating layer is covering the opening portion of the multilayer core substrate. The multilayer core substrate includes resin layers, inner layer conductor patterns formed on an inner layer of the resin layers and outer layer conductor patterns formed on an outer layer of the resin layers, and via conductors formed in the resin layers, and the multilayer core substrate is formed such that a distance from the opening portion to each of the inner layer conductor patterns is greater than a distance from the opening portion to each of the outer layer conductor patterns.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully