ADHESION FOR SHOE SOLE BONDING
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United States of America Patent
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Issued Date -
Oct 1, 2015
app pub date -
Mar 28, 2014
filing date -
Mar 28, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Embodiments of the present invention provide a method for constructing a shoe sole. Specifically, among other things, embodiments of the present invention provide a method for constructing a shoe sole including adhering an outsole to a midsole. The outsole is formed from an outsole compound. The outsole compound may include an organic compound and a porous material. The organic compound may have a boiling point greater than 120° C. The porous material may have a specific surface area greater than two square meters per gram. The organic compound may be supported on the porous material. The outsole is adhered to the midsole using an adhesive that includes an amine group composition.
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