SEALING RESIN COMPOSITION, SEALING FILM, WIRING BOARD, TFT DEVICE, OLED DEVICE, AND LED DEVICE

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United States of America Patent

SERIAL NO

14728139

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Abstract

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A sealing resin composition, which coats silver wiring or a laminate including the silver wiring, comprises: a fluorine-based resin (A); and a migration inhibitor (B) having a fluorine content rate of equal to or more than 35 mass % and less than 65 mass %, wherein the mass ratio ((B)/(A)) of the migration inhibitor (B) to the fluorine-based resin (A) is equal to or more than 0.0010 and less than 0.10.

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Patent Owner(s)

Patent OwnerAddress
FUJIFILM CORPORATIONTOKYO 106-8620

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
MATSUMURA, Tokihiko Kanagawa, JP 47 160
MATSUSHITA, Yasuaki Kanagawa, JP 31 105
OYA, Toyohisa Kanagawa, JP 50 299

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