Semiconductor device and method of manufacturing semiconductor device
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United States of America Patent
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Jun 28, 2016
Grant Date -
Oct 1, 2015
app pub date -
Feb 20, 2015
filing date -
Mar 31, 2014
priority date (Note) -
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Abstract
According to one embodiment, a semiconductor device includes a first conductor, a second conductor, and an envelope. The first conductor includes a first radiation surface. The second conductor includes a second radiation surface. The envelope includes a first envelope portion which is composed of a first insulative material and is formed such that the first envelope portion seals a semiconductor, and a second envelope portion which is composed of a second insulative material and is formed in contact with the first radiation surface and the second radiation surface.
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