Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods
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United States of America Patent
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Feb 23, 2016
Grant Date -
Oct 1, 2015
app pub date -
Mar 31, 2014
filing date -
Mar 31, 2014
priority date (Note) -
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Abstract
Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods are disclosed herein. In one embodiment, a semiconductor die assembly can include a stack of semiconductor dies and a thermally conductive casing at least partially enclosing the stack of semiconductor dies within an enclosure. A package substrate carries the thermally conductive casing, and an interposer is disposed between the thermally conductive casing and the stack of semiconductor dies. A peripheral portion of the interposer extends laterally beyond the stack of semiconductor dies and is coupled to a plurality of conductive members interposed between the peripheral portion and the package substrate.
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