Composite element chip, a semiconductor device and manufacturing method thereof, a printing head, and an image forming apparatus
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United States of America Patent
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Apr 4, 2017
Grant Date -
Oct 1, 2015
app pub date -
Mar 30, 2015
filing date -
Mar 31, 2014
priority date (Note) -
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Abstract
A composite element chip includes a substrate; and a plurality of semiconductor thin-films disposed on the substrate and arranged in a predetermined direction which is a first direction. Each semiconductor thin-film includes an array of a plurality of light emitting portions which are arranged so that adjacent light emitting portions are displaced from each other by a predetermined distance in a second direction which is perpendicular to the first direction, the plurality of light emitting portions being arranged along an imaginary line. Each semiconductor thin-film has a first end that is parallel to the second direction; and a second end that extends along a pattern in which the plurality of light emitting portions are arranged and is parallel to the imaginary line. A semiconductor device and manufacturing method thereof, a printing head, and an image forming apparatus are also disclosed.
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