EDGE CONTACTS OF CIRCUIT BOARDS, AND RELATED APPARATUS AND METHODS
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United States of America Patent
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N/A
Issued Date -
Oct 1, 2015
app pub date -
Mar 28, 2014
filing date -
Mar 28, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
In some embodiments, flat electrical contact pads may be fabricated along a routed edge face of a printed wiring board (PWB). Some embodiments of the edge pads may, for example, be perpendicular to a plane of the printed wiring board. In some embodiments, the edge pads may be of a specified length and/or width. Some embodiments of the edge pads may, for example, have a surface finish suitable for soldering and/or for direct contact interconnections. In some embodiments, the edge pads may, for example, be configured for electrical connection to an adjoining device (e.g., PWB) with mating pads to form a tiled array configuration of interconnected devices (e.g., PWBs).
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