Aluminum EMI / RF Shield
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United States of America Patent
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Issued Date -
Oct 1, 2015
app pub date -
Jun 10, 2015
filing date -
Mar 15, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A shield made from aluminum (AL) or an aluminum-based alloy coated with a solderable plating such as nickel or tin provides thermal improvement over existing shielding materials. The shield for circuitry on a circuit board comprising an aluminum material plated with a solderable material, the shield providing electromagnetic interference and radio frequency interference shielding and heat transfer when positioned over a circuit.
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