CLEAVING METHOD FOR TEMPERED GLASS

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20150284284A1
SERIAL NO

14420161

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Abstract

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A cleaving method for tempered glass includes forming a scribe line in the tempered glass from a front surface side of the tempered glass in a thickness direction along a preset cleaving line, followed by cleaving the tempered glass with the scribe line being set as a boundary. The tempered glass includes a front surface-side compressive stress layer formed on the front surface side and having compressive stress applied thereto, a back surface-side compressive stress layer formed on a back surface side of the tempered glass in the thickness direction and having compressive stress applied thereto, and an intermediate tensile stress layer formed between the front and back surface-side compressive stress layers and having tensile stress applied thereto. The forming of the scribe line includes increasing a thickness of the front surface-side compressive stress layer at least in the vicinity of the preset cleaving line.

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Patent Owner(s)

Patent OwnerAddress
NIPPON ELECTRIC GLASS CO LTD7-1 SEIRAN 2-CHOME OTSU-SHI SHIGA 520-8639

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Awazu, Akira Shiga, JP 1 4
Ichikawa, Koji Shiga, JP 299 1929
Konishi, Tomomi Shiga, JP 4 8
Kunitomo, Kazunobu Shiga, JP 4 7
Nakatsu, Hiroyuki Shiga, JP 4 5
Takeuchi, Hisahiro Shiga, JP 4 14

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