ELECTRODE FOR ELECTROLYTIC PLATING AND ELECTROLYTIC PLATING APPARATUS INCLUDING THE SAME
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United States of America Patent
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Issued Date -
Oct 8, 2015
app pub date -
Apr 1, 2015
filing date -
Apr 2, 2014
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Abstract
Disclosed are an electrode for electrolytic plating and an electrolytic plating apparatus including the same. A contact area between a surface of an object to be plated and an electrode can be minimized using an electrode for electrolytic plating having a non-conductive pattern partially formed thereon. Generation of a metal composite having multiple cores due to simultaneous contact between plural objects to be plated and the conductive region being not covered with non-conductive pattern can be prevented. Since the surface of the object to be plated can be coated with different kinds of metals before galvanic corrosion occurs, a metal composite having a core-shell structure can have improved reliability, quality and stability. Various different kinds of metals can be coated onto the surface of the object to be plated without limitation as the object to be plated.
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