ELECTRICALLY CONDUCTIVE POLYAMIDE MOULDING MATERIALS
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United States of America Patent
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Oct 8, 2015
app pub date -
Apr 7, 2015
filing date -
Apr 8, 2014
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Abstract
A polyamide molding material with the following composition is proposed:
- (a) 20 to 85% by weight of at least one semi-crystalline polyamide;(b) 4 to 18% by weight of carbon fibers with a fiber diameter in the range of 2 to 10 μm;(c) 10 to 60% by weight of at least one particulate mineral or saline filler;(d) 3 to 30% by weight of at least one amorphous polymer with a glass transition temperature of at least 45° C. determined according to ISO 11357;(e) 0 to 20% by weight of carbon black;(f) 0 to 20% by weight of at least one further additive and/or addition agent;wherein the components (a) to (f) add up in total to 100% by weight.
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