METHOD FOR COMBINED THROUGH-HOLE PLATING AND VIA FILLING

United States of America Patent

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Issued Date
Oct 8, 2015
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Nov 27, 2012
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Dec 21, 2011

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Abstract

The present invention relates to a method for copper electroplating in the manufacture of printed circuit boards, IC substrates and the like. Said method is suitable for a combined conformal through-hole filling and filling of blind micro vias. The method utilizes a metal redox system and pulse reverse plating.

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ATOTECH DEUTSCHLAND GMBH	ERASMUSSTRASSE 20 BERLIN 10553

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Inventor Name	Address	# of filed Patents	Total Citations
Chen, Ted	Shanghai, CN	13	291
Klobus, Marcin	Berlin, DE	2	2
Mirkovic, Marko	Berlin, DE	3	2
Moser, Christoph	Steyr, AT	1	2
Tang, Tiger	Shanghai, CN	1	2
Tong, Terry	Shanghai, CN	1	2

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METHOD FOR COMBINED THROUGH-HOLE PLATING AND VIA FILLING

Number of patents in Portfolio can not be more than 2000

United States of America Patent

14367242

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14367242

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