INTERPOSER AND METHOD FOR PRODUCING THE SAME
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United States of America Patent
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Issued Date -
Oct 15, 2015
app pub date -
Apr 7, 2015
filing date -
Apr 9, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An interposer includes a substrate, an electrically-conductive structure, at least one dielectric layer, a redistribution structure and electrode pads. The substrate is made of a ceramic material and has first and second surfaces and via holes. The electrically-conductive structure includes conductive pads, substrate vias disposed in the via holes, and layered electrically-conductive parts. The dielectric layer is disposed on the second surface to cover the layered electrically-conductive parts. The redistribution structure penetrates the dielectric layer and is connected to the layered electrically-conductive parts. The electrode pads are disposed on a surface of the dielectric layer.
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