Substrate plating jig
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United States of America Patent
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Jan 9, 2018
Issued Date -
N/A
app pub date -
Nov 14, 2012
filing date -
Nov 14, 2012
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A plating jig that can form a metal plating film simultaneously on both surfaces of a semiconductor wafer by one plating process. The plating jig includes a base section and a cover section that can hold a substrate to be plated, and a center section that holds the substrate between the base section and cover section; the base section, the cover section and the center section each having an annular portion having an opening at a center thereof; seal packings each having a conductive ring disposed thereon being attached to each of facing surfaces of the annular portions of the base section and the cover section; the substrate to be plated being disposed inside the opening of the center section; and the substrate to be plated being held from front and back surfaces thereof with the seal packings attached to the cover section and the center section.
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