MULTI-CIRCUIT-LAYER CIRCUIT BOARD
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United States of America Patent
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Issued Date -
Oct 15, 2015
app pub date -
Apr 9, 2014
filing date -
Apr 9, 2014
priority date (Note) -
Abandoned
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Abstract
A multi-circuit layer circuit board includes: two circuit layers formed on a substrate, the same circuit layer including a plurality of signal lines and a plurality of ground reference planes. At least one of the signal lines is formed between any two adjacent ground reference planes. The ground reference planes of one circuit layer are electrically coupled to the ground reference planes of the other circuit layer via a plurality of vias. One of the signal lines of one circuit layer is not overlapped with one signal line of the other circuit layer. The signal lines have a toggle rate higher than 800 MHz.
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