Inhibiting propagation of surface cracks in a MEMS device
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United States of America Patent
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Jan 10, 2017
Grant Date -
Oct 22, 2015
app pub date -
Jun 30, 2015
filing date -
Mar 22, 2013
priority date (Note) -
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Abstract
A microelectromechanical systems (MEMS) device includes a structural layer having a top surface. The top surface includes surface regions that are generally parallel to one another but are offset relative to one another such that a stress concentration location is formed between them. Laterally propagating shallow surface cracks have a tendency to form in the structural layer, especially near the joints between the surface regions. A method entails fabricating the MEMS device and forming trenchesin the top surface of the structural layer of the MEMS device. The trenches act as a crack inhibition feature to largely prevent the formation of deep cracks in structural layer which might otherwise result in MEMS device failure.
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