Film-forming apparatus to form a film on a substrate

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United States of America Patent

PATENT NO 10458017
APP PUB NO 20150299854A1
SERIAL NO

14440000

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A film forming apparatus includes a spray nozzle, a first chamber, a first gas supply port, a second chamber, a through hole, and a mist outlet. A solution transformed into droplets that is to be sprayed from the spray nozzle is housed in the first chamber and transformed into a mist in the first chamber by gas injected from the first gas supply port. The solution in mist form moves from the first chamber through the through hole to the second chamber and is misted onto a substrate from the mist outlet of the second chamber.

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Patent Owner(s)

  • TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hiramatsu, Takahiro Tokyo, JP 48 8578
Orita, Hiroyuki Tokyo, JP 32 38
Shirahata, Takahiro Tokyo, JP 21 140

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