PATTERN FORMING METHOD, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE

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United States of America Patent

SERIAL NO

14754017

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A pattern forming method of the present invention includes (a) forming a film using an actinic ray-sensitive or radiation-sensitive resin composition which contains (A) to (C) below,

    (A) a resin where polarity increases due to an action of acid and solubility decreases with respect to a developer which includes an organic solvent,(B) a compound which generates acid when irradiated with actinic rays or radiation, and(C) a compound which has a cation site and an anion site in the same molecule and where the cation site and the anion site are linked with each other by a covalent bond,(b) exposing the film, and(c) forming a negative tone pattern by developing the exposed film using a developer which includes an organic solvent.

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Patent Owner(s)

Patent OwnerAddress
FUJIFILM CORPORATIONTOKYO 106-8620

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
IWATO, Kaoru Haibara-gun, JP 69 420

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