Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods
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United States of America Patent
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Feb 14, 2017
Grant Date -
Oct 22, 2015
app pub date -
Jul 1, 2015
filing date -
Aug 31, 2006
priority date (Note) -
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Abstract
Microfeature workpieces having interconnects and conductive backplanes and associated systems and methods are disclosed herein. One such device includes a semiconductor substrate having integrated circuitry and terminals electrically coupled to the integrated circuitry. The device also includes electrically conductive interconnects extending through at least a portion of the semiconductor substrate and electrically coupled to corresponding terminals. The device further includes a conductive backplane assembly having a conductive layer at a back side of the semiconductor substrate. One or more of the interconnects are electrically coupled to the conductive layer at the back side of the semiconductor substrate.
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