THERMAL INTERFACE COMPOSITIONS AND METHODS FOR MAKING AND USING SAME
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United States of America Patent
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Oct 22, 2015
app pub date -
Nov 6, 2013
filing date -
Nov 9, 2012
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Abstract
A thermal interface material includes a conformable component and a thermally conductive filler dispersed in the conformable component. The material is provided in at least two segments laterally spaced from one another to define one or more gaps, each of the segments having a length, a width, and a height. The average aspect ratio of length to height and/or width to height of the at least two segments is between 1:10 and 10:1.
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