Semiconductor Package and Method of Manufacturing the Same
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United States of America Patent
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N/A
Issued Date -
Oct 22, 2015
app pub date -
Sep 4, 2014
filing date -
Apr 16, 2014
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Disclosed are a semiconductor package and a method of manufacturing the same. The semiconductor package includes a flexible substrate provided with signal lines, a semiconductor device bonded on the flexible substrate and configured to be connected to the signal lines through at least one of gold bumps or solder bumps, and a heat dissipation layer formed on at least a portion of the flexible substrate and at least a portion of the semiconductor device. The heat dissipation layer is formed by coating a heat dissipation paint composition and curing the heat dissipation paint composition. The heat dissipation paint composition includes an epichlorohydrin bisphenol A resin, a modified epoxy resin, a curing agent, a curing accelerator and a heat dissipation filler.
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