Importance

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Abstract

A chip package includes a semiconductor chip, a first chip, a first connection portion, a molding layer, a metal redistribution layer and a packaging layer. The semiconductor chip includes a first conductive pad and a second conductive pad disposed on an upper surface of the semiconductor chip. The first chip is disposed on the upper surface, and the first chip has at least a first chip conductive pad. The first connection portion directly electrically connects the first chip conductive pad and the first conductive pad. The molding layer covers the upper surface, the first chip and the first connection portion, and the molding layer is formed with an opening exposing a second conductive pad. The metal redistribution layer is disposed in the opening, electrically connected to the second conductive pad and extending to the molding layer. The packaging layer covers the metal redistribution layer and the molding layer.

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First Claim