SHIELD FILM AND SHIELD PRINTED WIRING BOARD
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United States of America Patent
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Issued Date -
Oct 22, 2015
app pub date -
Jun 4, 2013
filing date -
Jun 7, 2012
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Provided is a shield film having good shielding characteristics in the high frequency region, and a shield printed wiring board. A shield film, provided with, in a layered state: a plurality of metal layers (12, 14) (metal thin film (12), metal foil (14)); an insulating layer (13) disposed between the metal layers; and an electroconductive adhesive layer (15) disposed on the surface of the metal foil (14), from amongst the metal layers (12, 14), on which the insulating layer (13) is not disposed.
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