WIRING BOARD
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United States of America Patent
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N/A
Issued Date -
Oct 22, 2015
app pub date -
Apr 20, 2015
filing date -
Apr 22, 2014
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The wiring board according to the embodiment of the present invention includes a core substrate including a through-hole for a grounding and a through-hole for a power supply disposed adjacent to each other, and a build-up layer formed on one surface of the core substrate. The through-hole for a grounding and the through-hole for a power supply have a cross-sectional shape perpendicular to a thickness direction of the core substrate, being any one of a triangular shape, a quadrangular shape and a hexagonal shape, containing a corner portion and a side portion connecting between the corner portions. The side portions of the through-hole for a grounding and the through-hole for a power supply being mutually adjacent are disposed so as to face each other.
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