METHOD AND APPARATUS FOR CONNECTING CONNECTION ELEMENTS TO THE SUBSTRATE OF A POWER SEMICONDUCTOR MODULE BY WELDING
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United States of America Patent
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Mar 31, 2015
filing date -
Mar 31, 2014
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Abstract
Apparatus and method for connecting a connection element of a power semiconductor module to a conductor track by welding. The apparatus includes an abutment for the arrangement of the substrate. The abutment has first and second partial abutments. The first partial abutment is a metal shaped body with a modulus of elasticity of between 50 and 300 kN/mm2, and the second partial abutment is an elastic shaped body with a modulus of elasticity of between 10 and 500 N/mm2. A bottom element rests on the second partial abutment. The apparatus further includes a holding device to fix the bottom element on the abutment; a sonotrode; and a positioning device for positioning the connection element in relation to the substrate.
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