CMP slurry solution for hardened fluid material

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United States of America Patent

PATENT NO 9567493
SERIAL NO

14261644

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Abstract

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A method for performing a Chemical Mechanical Polishing (CMP) process includes applying a CMP slurry solution to a surface of a hardened fluid material on a substrate, the solution comprising an additive to change a bonding structure on the surface of the hardened fluid material. The method further includes polishing the surface of the hardened fluid material with a polishing head.

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Patent Owner(s)

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TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDHSINCHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chou, Yu-Wei Hsinchu, TW 15 48
Lee, Shen-Nan Hsinchu, TW 56 195
Lien, Kuo-Cheng Hsinchu, TW 13 50
Lin, Chang-Sheng Hsinchu, TW 59 166
Lin, Kuo-Yin Jhubei, TW 33 174
Liu, Wen-Kuei Hsinchu, TW 35 94
Tsai, Teng-Chun Hsinchu, TW 275 2741

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