ELECTROLESS DEPOSITION OF CONTINUOUS NICKEL LAYER USING COMPLEXED Ti3+ METAL IONS AS REDUCING AGENTS

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United States of America Patent

APP PUB NO 20150307994A1
SERIAL NO

14264997

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Abstract

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A solution for electroless deposition of nickel is provided. A reducing agent of Ti3+ ion is provided to the solution. Ni2+ ions are provided to the solution.

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Patent Owner(s)

Patent OwnerAddress
LAM RESEARCH CORPORATION4650 CUSHING PARKWAY FREMONT CA 94538

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
DORDI, Yezdi Palo Alto, US 117 2663
JAGMINIENE, Aldona Vilnius, LT 11 74
JOI, Aniruddha Fremont, US 19 17
NORKUS, Eugenijus Vilnius, LT 14 83
STANKEVICIENE, Ina Vilnius, LT 9 24
TAMASAUSKAITE-TAMASIUNAITE, Loreta Vilnius, LT 4 7

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