Method of Packaging Semiconductor Devices and Apparatus for Performing the Same
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United States of America Patent
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Issued Date -
Oct 29, 2015
app pub date -
Sep 25, 2014
filing date -
Apr 24, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Provided are a method and an apparatus for packaging semiconductor devices mounted on a flexible substrate having a longitudinally extending tape shape and defining packaging areas in a longitudinally extending direction along the flexible substrate. The flexible substrate is transferred through a packaging module. An empty area on which a semiconductor device is not mounted is detected from among the packaging areas, and a heat dissipation layer is formed on at least one semiconductor device located in a processing region of the packaging module so as to package the semiconductor device. The heat dissipation layer is formed by coating the semiconductor device with a heat dissipation paint composition, and operations of the packaging module are controlled by a controller to omit a packaging process on the empty area.
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