Chip packaging method and chip package using hydrophobic surface
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United States of America Patent
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Feb 14, 2017
Grant Date -
Oct 29, 2015
app pub date -
Apr 24, 2015
filing date -
Apr 25, 2014
priority date (Note) -
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Abstract
A chip packaging method using a hydrophobic surface includes forming superhydrophobic surfaces forming hydrophilic surfaces on predetermined positions of the superhydrophobic surfaces formed on the one of a first chip or the first board and the one of a second chip or a second board, respectively, generating liquid metal balls on the hydrophilic surfaces formed on the one of the first chip or the first board and the one of the second chip or the second board, respectively, and packaging the one of the first chip or the first board and the one of the second chip or the second board by combing the liquid metal ball of the one of the first chip or the first board and the liquid metal ball of the one of the second chip or the second board with each other.
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