LED lighting apparatus and method for manufacturing the same
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United States of America Patent
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Apr 11, 2017
Issued Date -
N/A
app pub date -
Apr 15, 2015
filing date -
Apr 23, 2014
priority date (Note) -
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Abstract
To provide an LED lighting apparatus and a method for manufacturing the same that can improve the bonding strength between an aluminum substrate and a printed wiring substrate. An LED lighting apparatus and a method for manufacturing the same, the LED lighting apparatus includes an aluminum substrate, a plurality of reflectivity-enhanced layers formed on the aluminum substrate, an LED device bonded on said plurality of reflectivity-enhanced layers, a printed wiring substrate bonded onto a region on the aluminum substrate other than a region where the plurality of reflectivity-enhanced layers are formed, a wire for connecting between the printed wiring substrate and the LED device, a frame member formed so as to surround said LED device, and a phosphor resin deposited over a region inside the frame member.
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