SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
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United States of America Patent
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Issued Date -
Nov 5, 2015
app pub date -
Apr 28, 2015
filing date -
Apr 30, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
A rotation holding device is rotated about a rotation axis, and a controller calculates a rotation direction offset amount, an X offset amount and a Y offset amount based on position data that is acquired from a line sensor. An X direction movable portion and a Y direction movable portion are moved such that the X offset amount and the Y offset amount become 0, and the rotation holding device is rotated such that the rotation direction offset amount becomes 0. A film thickness measurement device sequentially measures the thickness of a film on a substrate while the X direction movable portion is moved in an X direction.
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