Copper feature design for warpage control of substrates

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United States of America Patent

PATENT NO 9659131
SERIAL NO

14754585

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An approach is provided in which a laminate substrate includes top layers, bottom layers, and a core layer. The top layers are positioned between the core layer and a top surface metallurgy (TSM) layer and include at least one top conductive layer. The bottom layers are positioned between the core layer and a bottom surface metallurgy (BSM) layer and include at least one bottom conductive layer includes a material void pattern that is based upon the top conductive layer and reduces warpage of the laminate substrate.

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Patent Owner(s)

  • GLOBALFOUNDRIES INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Blackshear, Edmund Wappinger Falls, US 18 103
Call, Anson Jay Poughkeepsie, US 6 98
Khanna, Vijayeshwar Das Millwood, US 18 265
Powell, Douglas Oliver Endicott, US 4 47
Russell, David John Oswego, US 26 556

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