FLEXURAL PLATE WAVE DEVICE FOR CHIP COOLING
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United States of America Patent
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Issued Date -
Nov 5, 2015
app pub date -
Jul 16, 2015
filing date -
Aug 25, 2010
priority date (Note) -
Abandoned
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Abstract
Methods, systems, and apparatuses are described for cooling electronic devices. The electrical device includes an integrated circuit die (IC) having opposing first and second surfaces, a plurality of interconnects on the second surface of the IC die that enable the IC die to be coupled to a substrate, and a flexural plate wave device. The flexural plate wave device is configured to generate a stream of air to flow across the electrical device to cool the IC die during operation of the IC die.
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