Die warpage control for thin die assembly

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9659899
APP PUB NO 20150318258A1
SERIAL NO

14796759

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Importance

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Abstract

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Die warpage is controlled for the assembly of thin dies. In one example, a semiconductor die has a back side and a front side opposite the back side. The back side has a semiconductor substrate and the front side has components formed over the semiconductor substrate in front side layers. A backside layer is formed over the backside of the semiconductor die to resist warpage of the die when the die is heated and a plurality of contacts are formed on the front side of the die to attach to a substrate.

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Patent Owner(s)

  • INTEL CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Arana, Leonel R Phoenix, US 45 702
Deshpande, Nitin A Chandler, US 69 411
Ganapathysubramanian, Shankar San Jose, US 18 101
Li, Eric J Chandler, US 44 438
Poon, Poh Chieh Benny Chandler, US 2 8
Sanchez, Jorge Phoenix, US 49 748
Sane, Sandeep B Chandler, US 31 95
Seangatith, Jiraporn Chandler, US 10 8

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