INTEGRATED CIRCUIT PACKAGING SYSTEM WITH NO-REFLOW CONNECTION AND METHOD OF MANUFACTURE THEREOF
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United States of America Patent
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Issued Date -
Nov 5, 2015
app pub date -
Apr 27, 2015
filing date -
May 2, 2014
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Abstract
An integrated circuit packaging system, and a method of manufacture thereof, includes: an integrated circuit; a substrate having a substrate contact; an internal interconnect between the substrate and the integrated circuit, the internal interconnect is a no-reflow connection directly on the substrate contact and the integrated circuit; and an encapsulation over the internal interconnect.
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