Liquid ejection head and method of manufacturing the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9421771
APP PUB NO 20150321475A1
SERIAL NO

14706857

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Abstract

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A liquid ejection head includes a recording element substrate that ejects liquid, and an element-substrate support member to which the recording element substrate is bonded with an adhesive. A groove to be filled with the adhesive is provided in a bonding region of the element-substrate support member, at which the element-substrate support member and the recording element substrate are bonded together, along a part or an entirety of the outer circumference of the recording element substrate.

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Patent Owner(s)

  • CANON KABUSHIKI KAISHA

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akama, Yuichiro Tokyo, JP 36 219
Inada, Genji Koshigaya, JP 52 797
Seki, Sayaka Tokyo, JP 19 30
Tatsumi, Junji Kawasaki, JP 12 95

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