HYDROGEN-RELEASING FILM

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United States of America Patent

APP PUB NO 20150325380A1
SERIAL NO

14652144

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Abstract

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The purpose of the present invention is to provide a hydrogen-releasing film and a hydrogen-releasing laminated film which are less susceptible to embrittling at an ambient operating temperature of an electrochemical element. This hydrogen-releasing film comprises a Pd—Ag alloy and is characterized in that the content of Ag in the Pd—Ag alloy is 20 mol % or higher.

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Patent Owner(s)

Patent OwnerAddress
NITTO DENKO CORPORATION1-1-2 SHIMOHOZUMI IBARAKI-SHI OSAKA 567-8680
NATIONAL UNIVERSITY CORPORATION NAGOYA UNIVERSITY1 FURO-CHO CHIKUSA-KU NAGOYA-SHI AICHI 464-8601
INSTITUTE OF NATIONAL COLLEGES OF TECHNOLOGY701-2 HIGASHIASAKAWAMACHI HACHIOJI-SHI TOKYO 193-0834

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
FUKUOKA, Takahiro Ibaraki-shi, Osaka, JP 89 502
HATA, Kenta Ibaraki-shi. Osaka, JP 5 4
ISHII, Kyoko Ibaraki-shi, Osaka, JP 27 246
KIRA, Yoshiko Ibaraki-shi, Osaka, JP 20 16
NANBU, Tomonori Suzuka-shi, Mie, JP 6 5
YUKAWA, Hiroshi Nagoya-shi, Aichi, JP 14 63

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